FLIP-CHIP BONDER MICRON2
TheThe Micron2 is the benchmark platform in the high-end flip chip bonding and
advanced packaging market. In order to stay ahead and to remain competitive, the Micron2 owns all the prerequisites needed to be the most versatile platform in the world. Especially the enhanced vision features are key ingredients for fast and easy product changeovers, essential in the most challenging production environments – typically found in assembly houses.
The Micron 2 is incorporating more than 20 years of advanced packaging and flip chip experience. Evolved through hundreds of challenging applications and state-of-the-art processes, the Micron 2 is a well-refined, production-proven assembly platform delivering highest accuracy and reliability, both being key attributes of today’s and tomorrow’s production equipment.

SEMI-AUTOMATIC WAFER MOUNTER 651 & 851
The unique design of the POWATEC semiautomatic Wafer Mounters Type 651 and 851 make it possible to mount sticky tape and wafers onto frames in a single pass. A special chuck, covered with an easily exchangeable spong-like tape holds the wafer in place during mounting and absorbs contamination particles from the wafer surface. POWATEC's exclusive mounting method faciliates the void-free assembly of wafers, appliyng only low specific force.

MANUAL WAFER MOUNTER P-200 & P300
The unique design of the POWATEC P-200 and P300 Manual Wafer Mounter simplifies the mounting of sticky foil and wafers onto frames in a single pass. A special chuck covered with an easily exchangeable, sponge-like foil holds the wafer in place with vacuum during mounting and absorbs contamination particles from the wafer surface.

UV-LED CURING SYSTEM U-200 & U-300
The POWATEC Curing systems are built to cure up to a 12" wafer and frame. The LED generates a wavelength of 365 nm with an optical power output maximum of 270 mW. Open the cover and put the wafer on the left side conveyor. Push the start button. The wafer moves over the LED unit to the right side. Curing completes after about 20-30 seconds yielding a consistent throughput of 130-180 frames/hour. Fully adjustable curing time ranges between 15 seconds and 3 minutes.

MANUAL PROTECTION TAPE LAMINATOR L-200 & L-300
The unique design of the POWATEC L-200 and L-300 Manual Laminator allows for the lamination of sticky foil or UV-foil onto wafers in a single pass. A special chuck holds the wafer in place with vacuum during laminating.

EXPANSION TOOL FOR GRIP RINGS
The POWATEC Expansion Tool allows the expansion of the foil after dicing. The larger diameter grip ring is placed in the upper support of the Expansion Tool. The smaller grip ring is placed in the base support of the Expansion Tool. Between the two supports the diced wafer on the film frame will be placed on the base plate. Thereafter the grip rings are pressed together, which in turn expand the foil. The larger gap between the dies makes it easier to pick of the die from the sticky foil.

FILM FRAME CARRIER 300mm 13 & 25 SLOT
POWATEC’s 300 mm magazine was developed in close mutual cooperation with Infineon Germany and Micron USA. It complies with the SEMI Standard G77-0699

Special attention was paid to the weight of the magazine in order to keep it low. POWATEC also developed an automatic lock system which precludes frame from sliding out of the magazine during transportation.

ACCESORIES
- Boats
- Film Frames 6-12" (K&S or DISCO type)
- Film Frame Carriers 6-8" (K&S or DISCO type)
- Bluefoil