Auleetech was officially appointed by ESEC (BESI) to continue spares and service support for the ESEC Platform Micron2 and Micron5003. For Inquires please don't hesitate to contact us oliver.ackermann@auleetech.com

ESEC FLIP-CHIP BONDER MICRON2
TheThe Micron2 is the benchmark platform in the high-end flip chip bonding and advanced packaging market. In order to stay ahead and to remain competitive, the Micron2 owns all the prerequisites needed to be the most versatile platform in the world. Especially the enhanced vision features are key ingredients for fast and easy product changeovers, essential in the most challenging production environments – typically found in assembly houses.
The Micron 2 is incorporating more than 20 years of advanced packaging and flip chip experience. Evolved through hundreds of challenging applications and state-of-the-art processes, the Micron 2 is a well-refined, production-proven assembly platform delivering highest accuracy and reliability, both being key attributes of today’s and tomorrow’s production equipment.

ESEC FLIP-CHIP BONDER MICRON 5003
The Micron 5003 is the follow up model for the Micron2. It has the same functionality as the Micron2 but is faster and more accuracte (+/-10u 3 Sigma). Additionally it can also handle 12" Wafers.